Title:
FLOATING COIL HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2011/084363
Kind Code:
A3
Abstract:
The present application provides a heat exchanger assembly. The heat exchanger assembly may include a microchannel coil and a frame. The frame may include a slot to position the microchannel coil therein. A coil attachment may connect the microchannel coil at a first end of the frame.
Inventors:
TROUTMAN STEPHEN (US)
JENTZSCH CHRIS (US)
ATKINSON DUSTAN (US)
HARRY LINDSAY (US)
JENTZSCH CHRIS (US)
ATKINSON DUSTAN (US)
HARRY LINDSAY (US)
Application Number:
PCT/US2010/059988
Publication Date:
December 15, 2011
Filing Date:
December 13, 2010
Export Citation:
Assignee:
LENNOX INTERNATIONAL INC (US)
TROUTMAN STEPHEN (US)
JENTZSCH CHRIS (US)
ATKINSON DUSTAN (US)
HARRY LINDSAY (US)
TROUTMAN STEPHEN (US)
JENTZSCH CHRIS (US)
ATKINSON DUSTAN (US)
HARRY LINDSAY (US)
International Classes:
G06F1/20; B23P15/26; F28F1/00; F28F9/02
Foreign References:
DE10111384A1 | 2002-09-12 | |||
EP1046875A2 | 2000-10-25 | |||
US5715889A | 1998-02-10 | |||
EP1645829A2 | 2006-04-12 | |||
US20070044949A1 | 2007-03-01 |
Attorney, Agent or Firm:
WARREN, Daniel, J. et al. (999 Peachtree Street N, Atlanta GA, US)
Download PDF:
Previous Patent: SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION
Next Patent: MICROCHANNEL COIL MANIFOLD SYSTEM
Next Patent: MICROCHANNEL COIL MANIFOLD SYSTEM