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Patent Searching and Data


Title:
FLOCKED SPRING AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/172582
Kind Code:
A1
Abstract:
This flocked spring (30) has a spring body (31), a cationic electrodeposition coating layer (32) disposed on the surface of the spring body (31), an adhesive layer (33) disposed on the surface of the cationic electrodeposition coating layer (32), and a flocking layer (34) composed of a flocking filler fixed to the adhesive layer (33). The surface roughness Rz of the cationic electrodeposition coating layer (32) on which the adhesive layer (33) is disposed is 19.6 μm or greater. This method for producing a flocked spring has a cationic electrodeposition coating step for performing a cationic electrodeposition coating process on a spring body to form a film of an electrodeposition coating on the surface of the spring body, an adhesive application step for applying an adhesive that includes a roughening solvent to the surface of the coating film, a flocking step for bonding a flocking filler to the surface to which the adhesive has been applied, and a baking step for heating the spring body to which the flocking filler is bonded.

Inventors:
ITO SEIKI (JP)
KUNITA YASUHIKO (JP)
Application Number:
PCT/JP2021/046257
Publication Date:
August 18, 2022
Filing Date:
December 15, 2021
Export Citation:
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Assignee:
CHUO HATSUJO KK (JP)
International Classes:
B05D1/36; B05D3/02; B05D3/10; B05D7/00; B05D7/14; B05D7/24; C25D13/06; C25D13/10; F16F1/12
Domestic Patent References:
WO2019137069A12019-07-18
WO2014188912A12014-11-27
Foreign References:
JP2020019307A2020-02-06
JP2016169797A2016-09-23
JP2018159031A2018-10-11
JP2001150123A2001-06-05
CN207899626U2018-09-25
JPS61164682A1986-07-25
Attorney, Agent or Firm:
HIGASHIGUCHI Michiaki et al. (JP)
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