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Patent Searching and Data


Title:
FLOOR CONSTRUCTION STRUCTURE OF BUILDING THAT HAS EXCELLENT INTER-FLOOR SOUND INSULATION
Document Type and Number:
WIPO Patent Application WO/2018/038484
Kind Code:
A1
Abstract:
The present invention relates to a floor construction structure for a building that has excellent inter-floor sound insulation and heating efficiency. The present invention provides a floor construction structure for a building, the structure comprising: a floor structure; a shock buffering unit installed on the floor structure; a support unit installed on the shock buffering unit; a heating panel installed on the support unit; and a heating pipe installed in the heating panel. The heating panel comprises: an insulation member installed on the support unit; a thermally-conductive panel installed on the insulation member; and a heat pocket formed between the insulation member and the thermally-conductive panel. According to the present invention, excellent inter-floor sound insulation and heating efficiency are achieved due to an improved sound insulation structure and heating structure.

Inventors:
AN, Seung Han (13Mujin-gil, Wonju-si, Gangwon-do, 26327, KR)
Application Number:
KR2017/009092
Publication Date:
March 01, 2018
Filing Date:
August 21, 2017
Export Citation:
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Assignee:
AN, Seung Han (13Mujin-gil, Wonju-si, Gangwon-do, 26327, KR)
International Classes:
E04F15/22; E04F15/02; F24D3/14
Attorney, Agent or Firm:
NEIT INTERNATIONAL PATENT LAW FIRM (401122, Yeoksam-roGangnam-gu, Seoul, 06251, KR)
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