Title:
FLOOR HEATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/159378
Kind Code:
A1
Abstract:
A floor heating apparatus (1) has a floor heating panel (10), and a hose member (20) which is in contact with the lower surface of the floor heating panel (10) and through which an aqueous solution flows at an inner diameter part. The floor heating panel (10) has: a panel plate body (11); an upper side metal plate (12) fixed to the front surface of the panel plate body (11) and a lower side metal plate (13) fixed to the rear surface thereof; and a metal member (14) that is interposed between the upper side and lower side metal plates (12, 13) and penetrates, and attaches to, the panel plate body (11). The hose member (20) is interposed between the floor heating panel (10) and a substrate member (40) on which the floor heating panel (10) is placed, the floor heating panel and the substrate member being set apart from each other by a predetermined distance (D). The hose member (20) is in contact with the lower surface of the floor heating panel (10) while deforming in a radial direction.
Inventors:
CHO BYUNGCHUL (JP)
Application Number:
PCT/JP2018/009269
Publication Date:
August 22, 2019
Filing Date:
March 09, 2018
Export Citation:
Assignee:
CHO BYUNGCHUL (JP)
International Classes:
F24D3/16
Foreign References:
| JP2006183985A | 2006-07-13 | |||
| JP2000111070A | 2000-04-18 | |||
| US20150136361A1 | 2015-05-21 | |||
| JPS63108134A | 1988-05-13 | |||
| JPS5813414U | 1983-01-27 | |||
| JPS59195411U | 1984-12-26 | |||
| EP3217102A1 | 2017-09-13 |
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
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