Title:
FLOOR PANEL FOR COOLING OR HEATING
Document Type and Number:
WIPO Patent Application WO/2013/081434
Kind Code:
A1
Abstract:
Disclosed is a floor panel for cooling or heating to be used in cooling or heating an indoor area. The floor panel for cooling or heating comprises: a panel body having a flow channel formed therein and having an inlet port and an outlet port of the flow channel; and a spacer protruded downwardly from the bottom surface of the panel body so as to form a heat insulation space in the bottom surface. Thus, the heat insulation space and a heat reserving layer of the floor may perform a heat insulation operation to prevent dew condensation even when cold water is supplied to the flow channel in the summer. Thus, the floor panel of the present invention may be used in a cooling operation as well as in a heating operation.
More Like This:
| WO/2009/116699 | HOT WATER FLOOR AND METHOD FOR CONSTRUCTING THE SAME |
| WO/2009/113073 | CONCENTRATED SOLAR HEATING |
Inventors:
LEE SANG WON (KR)
Application Number:
PCT/KR2012/010365
Publication Date:
June 06, 2013
Filing Date:
December 03, 2012
Export Citation:
Assignee:
LEE SANG WON (KR)
International Classes:
F24D3/12; E04F15/18
Foreign References:
| JP2001355863A | 2001-12-26 | |||
| KR20060104065A | 2006-10-09 | |||
| JPH09222236A | 1997-08-26 | |||
| JP2007093027A | 2007-04-12 |
Attorney, Agent or Firm:
B&IP-JOOWON PATENT AND LAW FIRM (KR)
특허법인주원 (KR)
특허법인주원 (KR)
Download PDF:
Claims: