Title:
FLOOR PANEL SYSTEM
Document Type and Number:
WIPO Patent Application WO/2013/058437
Kind Code:
A1
Abstract:
The present invention relates to a floor panel system, and in particular, to a floor panel system constructed to enable cooling and heating. The floor panel system of the present invention includes: a connection unit including a pipe connecting part; and a plurality of pipe panels having pipes laid in a line along the connection unit in order to form one floor together with the connection unit, and including an inflow unit and an outflow unit which have the pipes flowing in and out at parts thereof connected to the connection unit so as to be interconnected with each other through the pipe connecting part.
Inventors:
JUNG OH CHOL (KR)
Application Number:
PCT/KR2011/009805
Publication Date:
April 25, 2013
Filing Date:
December 19, 2011
Export Citation:
Assignee:
ON YOU CO LTD (KR)
JUNG OH CHOL (KR)
JUNG OH CHOL (KR)
International Classes:
F24D3/12; E04F15/18
Foreign References:
| US6079170A | 2000-06-27 | |||
| KR100857075B1 | 2008-09-05 | |||
| KR880008247U | ||||
| KR20080093620A | 2008-10-22 | |||
| JPH08296861A | 1996-11-12 |
Attorney, Agent or Firm:
B&IP-JOOWON PATENT AND LAW FIRM (KR)
특허법인주원 (KR)
특허법인주원 (KR)
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Claims:
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