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Patent Searching and Data


Title:
FLOOR PANEL
Document Type and Number:
WIPO Patent Application WO/2015/037492
Kind Code:
A1
Abstract:
A floor panel comprising an inorganic base, a sealer layer formed on the inorganic base by applying a sealer including at least one resin selected from acrylic resins, acrylic/styrene resins, urethane resins, and epoxy resins, and a moistureproof agent layer formed on the sealer layer by applying a moistureproof agent that comprises: an emulsion of a mixture of a paraffin wax having a melting point of 50-70°C and a resin having an acid value of 10-40 and obtained by modifying a dicyclopentadiene-based petroleum resin with maleic acid; a binder ingredient; and a film formation aid ingredient.

Inventors:
TANAKA DAISUKE (JP)
YAMANAKA TAKASHI (JP)
ITO MASAKAZU (JP)
Application Number:
PCT/JP2014/073173
Publication Date:
March 19, 2015
Filing Date:
September 03, 2014
Export Citation:
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Assignee:
NICHIAS CORP (JP)
International Classes:
E04F15/02; B32B27/30
Foreign References:
JP2010095991A2010-04-30
JP2004084152A2004-03-18
JP2008063831A2008-03-21
JP2000185368A2000-07-04
JP2010188327A2010-09-02
JP2001191447A2001-07-17
JP2003155786A2003-05-30
JP2001129955A2001-05-15
JP2009143615A2009-07-02
Attorney, Agent or Firm:
AIWA INTERNATIONAL PATENT AGENCY (JP)
It suits and is わ特許業務法人. (JP)
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