Title:
FLOORING ASSEMBLY WITH HEAT DISSIPATION LAYER
Document Type and Number:
WIPO Patent Application WO/2014/031528
Kind Code:
A3
Abstract:
A flooring assembly (100) for a compartment floor includes a panel (104) made up of a first skin (126), a second skin (128) positioned below the first skin, and a core (120) encapsulated within the panel between the first and second skins and peripheral closeouts (124). A heat dissipation layer (116) is provided in the flooring assembly at or above the first skin.
Inventors:
DESING JAMES E (US)
BIDDLE ANDREW J (US)
BIDDLE ANDREW J (US)
Application Number:
PCT/US2013/055556
Publication Date:
May 22, 2014
Filing Date:
August 19, 2013
Export Citation:
Assignee:
MILWAUKEE COMPOSITES INC (US)
International Classes:
B61D17/10; E04F15/10; E04B1/94; E04C2/52
Domestic Patent References:
| WO2001017850A1 | 2001-03-15 |
Foreign References:
| EP0241116A1 | 1987-10-14 | |||
| US20020100404A1 | 2002-08-01 | |||
| US4255482A | 1981-03-10 | |||
| US2601284A | 1952-06-24 |
Attorney, Agent or Firm:
HONGSERMEIER, Jayson, L. et al. (100 East Wisconsin Avenue Suite 330, Milwaukee WI, US)
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