Title:
FLOW CONTROL METHOD AND COMPUTING NODE
Document Type and Number:
WIPO Patent Application WO/2024/066441
Kind Code:
A1
Abstract:
A flow control method and a computing node (100, 200, 300). The flow control method is applied to the computing node (100, 200, 300). The computing node (100, 200, 300) comprises a housing, a device (101) to be subjected to heat dissipation, and a spray nozzle (102, 305). Said device (101) and the spray nozzle (102, 305) are located in a sealed chamber of the housing. The flow control method comprises: obtaining a node parameter of the computing node (100, 200, 300) (S401), the node parameter comprising at least one of the following: a processor parameter of a processor (201, 302) and pressure information of the sealed chamber, and said device (101) comprising the processor (201, 302); and according to the node parameter, adjusting the flow of the spray nozzle (102, 305) to spray a liquid cooling medium to said device (101) (S402). According to the flow control method, the flow of the spray nozzle (102, 305) can be adjusted according to the node parameter of the computing node (100, 200, 300), to achieve the purpose of adjusting the height of a liquid level in the computing node (100, 200, 300), so that the refrigeration effect of the computing node (100, 200, 300) is good.
Inventors:
JIA HUI (CN)
SUN YONGFU (CN)
DING JUNFENG (CN)
SUN YONGFU (CN)
DING JUNFENG (CN)
Application Number:
PCT/CN2023/097951
Publication Date:
April 04, 2024
Filing Date:
June 02, 2023
Export Citation:
Assignee:
XFUSION DIGITAL TECH CO LTD (CN)
International Classes:
H05K7/20; G05D27/02
Foreign References:
| CN114144016A | 2022-03-04 | |||
| CN114901037A | 2022-08-12 | |||
| CN113115563A | 2021-07-13 | |||
| CN112702886A | 2021-04-23 | |||
| US20110132579A1 | 2011-06-09 | |||
| CN111885904A | 2020-11-03 | |||
| US20130264046A1 | 2013-10-10 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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