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Patent Searching and Data


Title:
FLOW PATH CHIP
Document Type and Number:
WIPO Patent Application WO/2024/018926
Kind Code:
A1
Abstract:
A flow path chip (1) comprises: a plurality of filter layers (40); a first common supply path (5); a common flow path (7); and a dielectrophoretic layer (50). The plurality of filter layers (40) each have an HDF (3). The first common supply path (5) supplies a sample liquid (L1) to the HDFs (3) of the plurality of filter layers (40). The common flow path (7) allows a liquid to pass therethrough after the liquid passed through the plurality of HDFs. The dielectrophoretic layer (50) includes an electrode (51) and an electrode (53) that cause dielectric particles, which are included in the liquid that passed through the common flow path (7), to migrate dielectrophoretically. The plurality of filter layers (40) and the dielectrophoretic layer (50) are laminated together.

Inventors:
URAKAWA SATOSHI (JP)
SANADA MASAKAZU (JP)
Application Number:
PCT/JP2023/025289
Publication Date:
January 25, 2024
Filing Date:
July 07, 2023
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
B03C5/00; C12M1/00; G01N37/00
Domestic Patent References:
WO2019078277A12019-04-25
WO2021079826A12021-04-29
WO2010113994A12010-10-07
Foreign References:
JP2017134020A2017-08-03
JP2020099256A2020-07-02
US20210260602A12021-08-26
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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