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Title:
FLOW PATH DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112932
Kind Code:
A1
Abstract:
A flow path device 1 according to the present invention comprises: a flow path joint 2 that forms at least a part of a reaction flow path of a flow reactor 5; and a temperature sensor 3, wherein the flow path joint 2 has a first connection opening 8a, a second connection opening 9a, an attachment opening 10a, and a linear flow path 11 that has a communication opening 11a which is in communication with the second connection opening 9a and that extends from the first connection opening 8a to the attachment opening 10a, and the temperature sensor 3 is attached to the attachment opening 10a and extends in the lengthwise direction in the linear flow path 11 beyond the communication opening 11a.

Inventors:
IMAMURA YUSUKE (JP)
Application Number:
PCT/JP2022/045922
Publication Date:
June 22, 2023
Filing Date:
December 13, 2022
Export Citation:
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Assignee:
YOKOGAWA ELECTRIC CORP (JP)
International Classes:
B01J19/24
Domestic Patent References:
WO2020008806A12020-01-09
WO2019187497A12019-10-03
Foreign References:
JP2008504535A2008-02-14
JP2019500202A2019-01-10
JP2009085762A2009-04-23
JP2013164377A2013-08-22
JP2014006260A2014-01-16
US20070166212A12007-07-19
US20110166367A12011-07-07
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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