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Title:
FLOW PATH MEMBER, AND HEAT EXCHANGER AND SEMICONDUCTOR MANUFACTURING APPARATUS USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/180250
Kind Code:
A1
Abstract:
[Problem] To provide a flow path member having improved heat exchange efficiency, as well as a heat exchanger and a semiconductor manufacturing apparatus using this flow path member. [Solution] A flow path member equipped with a lid part, a bottom panel part, and side wall parts provided between the lid part and the bottom panel part, with the lid part, the bottom panel part and the side wall parts forming a flow path within which a fluid flows. A portion of the surface of the side wall parts on the flow-path side has a coarse part that is coarser than other areas, so obstruction of the flow of the fluid is suppressed, and the fluid easily forms a turbulent flow due to the existence of the coarse part, thereby increasing the heat exchange efficiency of the flow path member.

Inventors:
SEKIGUCHI KEIICHI (JP)
FUJIO KAZUHIKO (JP)
ISHIMINE YUUSAKU (JP)
Application Number:
PCT/JP2013/065118
Publication Date:
December 05, 2013
Filing Date:
May 30, 2013
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
F28F3/12; H01L21/265; H01L21/3065; H01L21/31; H01L21/683
Foreign References:
JP2007123547A2007-05-17
JP2009176881A2009-08-06
JP2004144460A2004-05-20
JP2011216517A2011-10-27
JPH03142861A1991-06-18
JP2007251002A2007-09-27
JP2007103748A2007-04-19
JP2001118972A2001-04-27
JP2007035878A2007-02-08
JP2009530582A2009-08-27
Other References:
See also references of EP 2857786A4
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