Title:
FLOW RATE MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/208931
Kind Code:
A1
Abstract:
Provided is a flow rate measurement device that can suppress peeling between: an intermediate member arranged between a flow rate measurement element and a lead frame; and a resin sealant. In plan view of a chip package 400 viewed from a direction orthogonal to the surface of a diaphragm 411a of the chip package 400, a peripheral edge 408a of an intermediate member 408 is sealed with a resin sealant 401. In the intermediate member 408, in plan view, at a position outside a first region R1 in which a flow measurement element 411 is mounted, a recessed portion 434 recessed inward from the peripheral edge 408a or an opening portion 431 opened on the inside of the peripheral edge 408a is formed, and the recessed portion 434 or the opening portion 431 is filled with a resin of the resin sealant 401.
Inventors:
FATIN FARHANAH BINTI HARIDAN (JP)
IJUIN MIZUKI (JP)
YOGO TAKAYUKI (JP)
IJUIN MIZUKI (JP)
YOGO TAKAYUKI (JP)
Application Number:
PCT/JP2021/032484
Publication Date:
October 06, 2022
Filing Date:
September 03, 2021
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
G01F1/684
Domestic Patent References:
| WO2013084259A1 | 2013-06-13 |
Foreign References:
| JP2020041815A | 2020-03-19 | |||
| JP2013195231A | 2013-09-30 |
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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