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Patent Searching and Data


Title:
FLOW RATE SENSOR
Document Type and Number:
WIPO Patent Application WO/2016/039019
Kind Code:
A1
Abstract:
This flow rate sensor is provided with: a semiconductor chip which has a thermal flow rate sensing part on a main surface; a supporting member which supports the semiconductor chip; an intermediate member which is interposed between the supporting member and the semiconductor chip; and a sealing resin which covers the main surface of the semiconductor chip so that the flow rate sensing part is exposed therefrom. The intermediate member is formed from a filler-containing synthetic resin wherein a filler is contained in a synthetic resin, said filler having a higher elastic modulus and a lower linear expansion coefficient than the synthetic resin.

Inventors:
KONO TSUTOMU (JP)
WATANABE TSUBASA (JP)
NAKATSUCHI HIROKI (JP)
TOKUYASU NOBORU (JP)
TASHIRO SHINOBU (JP)
SAKAMOTO TSUTOMU (JP)
Application Number:
JP2015/070705
Publication Date:
March 17, 2016
Filing Date:
July 21, 2015
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01F1/684
Foreign References:
JP2014134519A2014-07-24
JP2008146750A2008-06-26
Attorney, Agent or Firm:
NAGAI, Fuyuki (JP)
Fuyuki Nagai (JP)
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