Title:
FLOW SENSOR CHIP
Document Type and Number:
WIPO Patent Application WO/2020/241262
Kind Code:
A1
Abstract:
Provided is a flow sensor chip that can prevent wasteful consumption of electric power when electrifying a heater. A heater including a heater part and a lead part connected to each end of the heater part and made of a material having an electric conductivity higher than that of a constituent material for the heater part is provided in a thin film-shaped part of the flow sensor chip including a substrate part having a cavity opened to a first surface side and the thin film-shaped part provided on the first surface of the substrate part. The flow sensor chip includes: a first lead part that is connected to one end of the heater part; a second lead part that is connected to the other end of the heater part; a first electrode pad that is connected to the end, of the first lead part, not connected to the heater part directly or through a connection part made of a material having electric conductivity higher than the heater conductivity; and a second electrode pad that is connected to the end, of the second lead part, not connected to the heater part directly or through a connection part made of a material having electric conductivity higher than the heater conductivity.
Inventors:
NAKANO YU (JP)
KASAI TAKASHI (JP)
MOMOTANI KOJI (JP)
KASAI TAKASHI (JP)
MOMOTANI KOJI (JP)
Application Number:
PCT/JP2020/019136
Publication Date:
December 03, 2020
Filing Date:
May 13, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
G01P5/10; G01F1/688
Domestic Patent References:
| WO1998050763A1 | 1998-11-12 |
Foreign References:
| EP3404373A1 | 2018-11-21 | |||
| JP2012127965A | 2012-07-05 | |||
| JPH08122118A | 1996-05-17 |
Other References:
See also references of EP 3978933A4
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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