Title:
FLUID CHIP-LEVEL UNDERFILL RESIN AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/181447
Kind Code:
A1
Abstract:
A fluid chip-level underfill resin and manufacturing method thereof. The underfill resin comprises the following components in parts by weight: 18-30 parts of an epoxy resin; 1-3 parts of a toughener; 0.1-1 parts of a wetting and dispersing agent; 0.1-1 parts of a coupling agent; 0.1-0.5 parts of a carbon black; 50-70 parts of a filler; and 8-15 parts of a curing agent. The resin features a low coefficient of thermal expansion, high flexural modulus, and low hygroscopicity. Adding the wetting and dispersing agent effectively reduced resin viscosity and improved resin flow rate, ensuring uniform distribution of the filler and a reliability of a packaged component.
Inventors:
YAN SHANTAO (CN)
WANG JIANBIN (CN)
CHEN TIANAN (CN)
XIE HAIHUA (CN)
WANG JIANBIN (CN)
CHEN TIANAN (CN)
XIE HAIHUA (CN)
Application Number:
PCT/CN2016/081230
Publication Date:
October 26, 2017
Filing Date:
May 06, 2016
Export Citation:
Assignee:
YANTAI DARBOND TECHNOLOGY CO (CN)
International Classes:
C09J163/00; C09J163/02
Foreign References:
| CN105295796A | 2016-02-03 | |||
| CN103937433A | 2014-07-23 | |||
| CN102559115A | 2012-07-11 | |||
| US4536524A | 1985-08-20 |
Attorney, Agent or Firm:
YANTAI SHANGHE INTELLECTUAL PROPERTY AGENCY(GENERAL PARTNERSHIP) (CN)
Download PDF: