Title:
FLUID CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/025550
Kind Code:
A1
Abstract:
There is provided a fluid control device which can easily be installed in a semiconductor manufacturing device and in which wiring connection can easily be performed. It is possible to reduce a pressure loss caused by wiring connection and easily modify the arrangement of each module. Even if a corrosive fluid is used, no corrosion occurs. Even if the fluid flowing into is pulsating, it is possible to control the flow rate. The fluid control device includes: a fluid rate sensor unit having a first ultrasonic vibrator for transmitting an ultrasonic wave into the fluid and a second ultrasonic vibrator for receiving the ultrasonic wave from the first ultrasonic vibrator and outputting a signal to a flow rate amplification unit; and a control valve for controlling the fluid flow state to a predetermined state by an operation pressure. The flow rate sensor unit and the control valve are arranged in a casing having a fluid flow input and a fluid flow exit.
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Inventors:
YOSHINO KENRO (JP)
Application Number:
PCT/JP2005/016168
Publication Date:
March 09, 2006
Filing Date:
August 29, 2005
Export Citation:
Assignee:
ASAHI ORGANIC CHEM IND (JP)
YOSHINO KENRO (JP)
YOSHINO KENRO (JP)
International Classes:
G05D7/06; G01F1/66; F16K31/124; F16K31/128
Foreign References:
| JPH0683456A | 1994-03-25 | |||
| JPH09502292A | 1997-03-04 | |||
| JPH0639294Y2 | 1994-10-12 | |||
| JPH09303609A | 1997-11-28 | |||
| JPH01134213A | 1989-05-26 | |||
| JP2004038571A | 2004-02-05 |
Attorney, Agent or Firm:
Aoki, Atsushi (Ishida & Associates Toranomon 37 Mori
Bldg., 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, JP)
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