FLUID COOLING APPARATUS - SAMSUNG HEAVY IND

Title:

FLUID COOLING APPARATUS

Document Type and Number:

WIPO Patent Application WO/2017/222138

Kind Code:

A1

Abstract:

The present invention relates to a fluid cooling apparatus for improving the efficiency of a fluid liquefaction process by appropriately lowering, various sections of the temperature range of a fluid through a simple process. The fluid cooling apparatus comprises: an expansion unit including a plurality of expanders for respectively receiving refrigerants through a plurality of paths so as to respectively expand the same and discharge the refrigerants having different temperatures; a heat exchanger for respectively receiving the refrigerants having different temperatures from the expansion unit so as to cool the fluid in multiple stages; a pre-compression unit including a plurality of pre-compressors, which respectively receive the refrigerant having passed through the heat exchanger, respectively compress the same, and discharge the refrigerant at the same pressure; a mixing pipe for mixing and supplying the refrigerants discharged from the pre-compression unit; and a main compression unit connected to the mixing pipe, compressing the refrigerant, and supplying the same to the expansion unit.

Inventors:

LEE DONGHUN (KR)
KIM MUNGYU (KR)
MIN JOONHO (KR)
PARK HYUNKI (KR)
LEE CHIHUN (KR)

Application Number:

PCT/KR2017/001019

Publication Date:

December 28, 2017

Filing Date:

January 31, 2017

Export Citation:

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Assignee:

SAMSUNG HEAVY IND (KR)

International Classes:

F25B9/06; F25B31/00; F25B41/00; F25J1/00

Foreign References:

KR101056890B1	2011-08-12
US6250244B1	2001-06-26
US7644595B2	2010-01-12
KR20120003224A	2012-01-10
KR200318040Y1	2003-06-28

Other References: