Title:
FLUID COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2001/038806
Kind Code:
A1
Abstract:
A fluid cooling device which does not require a large amount of cooling water and can cool a fluid with higher efficiency, wherein a fluid to be cooled flows from below to above through a main pipe (10) as indicated by the arrows. Air is allowed to flow downwards through a preset space provided between a water retaining material (11) and an outer pipe (12), and water dripped in a constant amount at a time from a tank (20) is supplied to the water retaining material (11) and allowed to diffuse quickly to keep the material (11) in a moist condition. Water comes into close contact with the flowing air and evaporates vigorously from the surface of the material (11). Since an evaporating water absorbs a vaporization heat of about 580 calories/1 cc from the surroundings, a vigorously evaporating water from the material (11) quickly reduces the temperature of the main pipe (10) to cool a medium to be cooled flowing thereinside.
Inventors:
ICHIGAYA HIROSHI (JP)
Application Number:
PCT/JP1999/006490
Publication Date:
May 31, 2001
Filing Date:
November 19, 1999
Export Citation:
Assignee:
SEFT DEV LAB CO LTD (JP)
ICHIGAYA HIROSHI (JP)
ICHIGAYA HIROSHI (JP)
International Classes:
F25D7/00; F28D5/02; (IPC1-7): F25D7/00; A23L3/36
Foreign References:
| JPS5216041A | 1977-02-07 | |||
| JPH06241636A | 1994-09-02 | |||
| JPH0281363U | 1990-06-22 |
Attorney, Agent or Firm:
Handa, Masao (3-8Wada 2-chome Suginami-ku, Tokyo, JP)
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