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Patent Searching and Data


Title:
FLUID FILLED VIBRATION DAMPING DEVICE AND METHOD FOR MANUFACTURING FLUID FILLED VIBRATION DAMPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/110357
Kind Code:
A1
Abstract:
Provided are: a fluid filled vibration damping device in which fluid sealing of a first fluid chamber and a second fluid chamber can be easily and highly ensured, and which has a novel structure; and a method for manufacturing the fluid filled vibration damping device. In the present invention: the outer peripheral portion of a partitioning member 40, which partitions a first fluid chamber 86 and a second fluid chamber 88, is superposed onto a second attachment member 22 with a first seal rubber 38 interposed therebetween, the first seal rubber 38 integrally formed with a first rubber elastic body 24 and; and the partitioning member 40 and the second attachment member 22 are engaged with and fixed to each other by means of a first hooking part 72 provided further on the outer peripheral side than the first seal rubber 38. Meanwhile, a holding member 78, which holds the outer peripheral portion of a second rubber elastic body 74, is superposed onto the outer peripheral portion of the partitioning member 40 with a second seal rubber 76 interposed therebetween, the second seal rubber 76 integrally formed on the outer peripheral portion of the second rubber elastic body 74, and the partitioning member 40 and the holding member 78 are engaged with and fixed to each other by a second hooking part 84 provided further on the outer peripheral side than the second seal rubber 76.

Inventors:
KONDO HIROKI (JP)
OKI KENJI (JP)
Application Number:
JP2019/025046
Publication Date:
June 04, 2020
Filing Date:
June 25, 2019
Export Citation:
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Assignee:
SUMITOMO RIKO CO LTD (JP)
International Classes:
F16F13/10; B60K5/12
Domestic Patent References:
WO2018135312A12018-07-26
Foreign References:
JP2017214968A2017-12-07
JP2017180779A2017-10-05
JP2009092137A2009-04-30
US20120267184A12012-10-25
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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