Title:
FLUID HANDLING APPARATUS AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2013/118447
Kind Code:
A1
Abstract:
A resin substrate (120) that is provided with a groove (129) on one surface and a PET film (140) that is provided with an adhesive layer (160), which contains an acrylic resin component and a urethane resin component, on one surface are prepared. The PET film (140) is arranged on one surface of the resin substrate (120) such that the adhesive layer (160) is positioned between the resin substrate (120) and the PET film (140). The resin substrate (120) and the PET film (140) are bonded with each other by heating the adhesive layer (160) at a predetermined bonding temperature. At this time, the glass transition temperature (TgA) of the resin substrate (120), the melting point (TmB) of the PET film (140), the glass transition temperature (TgC) of the adhesive layer (160) and the bonding temperature (Tp) satisfy TgC < Tp < TgA < TmB.
Inventors:
KITAMOTO KEN
Application Number:
PCT/JP2013/000420
Publication Date:
August 15, 2013
Filing Date:
January 28, 2013
Export Citation:
Assignee:
ENPLAS CORP (JP)
International Classes:
G01N35/08; B01J19/00; B29C65/48; G01N37/00; B29K67/00
Foreign References:
| JP2012007920A | 2012-01-12 |
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
Koichi Washida (JP)
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Claims: