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Patent Searching and Data


Title:
FLUID HANDLING DEVICE AND FLUID HANDLING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2012/137413
Kind Code:
A1
Abstract:
The present invention relates to a microchannel chip capable of preventing fluid leakage caused by a lamination defect. Bottomed first regions (23a', 23b'), second regions (24a', 24b'), and third regions (25a', 25b') are formed by joining a film (14) to a lower surface (21) of the chip main body (12) of a microchannel chip (10). The third regions (25a', 25b') are in communication with the second regions (24a', 24b') and are formed on carbon inks (16a, 16b). The third regions (25a', 25b') are formed wider than the carbon inks (16a, 16b) are. The third regions (25a', 25b') are filled with an electroconductive adhesive.

Inventors:
NAKAO TOMOKI
ONO KOICHI
Application Number:
PCT/JP2012/001690
Publication Date:
October 11, 2012
Filing Date:
March 12, 2012
Export Citation:
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Assignee:
ENPLAS CORP (JP)
NAKAO TOMOKI
ONO KOICHI
International Classes:
G01N35/08; B01J19/00; G01N27/447; G01N37/00
Foreign References:
JP2006517652A2006-07-27
JP2006142198A2006-06-08
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
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