Title:
FLUID SUPPLY SYSTEM AND MOLDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2015/166955
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a fluid supply system that can supply a fluid such that internal pressure fluctuations in an introduction chamber that is provided to a discharge device can be suppressed to a minimum and such that defects in the discharge of the fluid can be suppressed to a minimum, and to provide a molding system that is provided with the fluid supply system. [Solution] A fluid supply system (50) that has a supply path (60) that is connected to a discharge device (20), a pump (80) that is connected to the supply path (60), a valve (70) that can cut off the flow of a fluid that flows toward an introduction chamber (28) via the supply path (60), and a control device (100) that determines the pressure state on the pump (80) side and controls the opening/closing of the valve (70) on the basis of the determination results. When the pressure state is determined to be such that a pressure (P1) on the pump (80) side exceeds a prescribed pressure, the control device (100) performs opening/closing control such that the valve (70) is open.
Inventors:
YAMANE TETSUO (JP)
NAKAZAWA MASAKI (JP)
TANITO ATSUSHI (JP)
NAKAZAWA MASAKI (JP)
TANITO ATSUSHI (JP)
Application Number:
PCT/JP2015/062860
Publication Date:
November 05, 2015
Filing Date:
April 28, 2015
Export Citation:
Assignee:
HEISHIN LTD (JP)
International Classes:
B05B7/32; B29C31/06
Foreign References:
| JP2006503739A | 2006-02-02 | |||
| JP2011245790A | 2011-12-08 | |||
| JP2012086444A | 2012-05-10 | |||
| JP2011201066A | 2011-10-13 | |||
| JP2011161413A | 2011-08-25 |
Attorney, Agent or Firm:
Sakiyama 博教 (JP)
SAKIYAMA, Hironori (JP)
SAKIYAMA, Hironori (JP)
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