Title:
FLUID SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/084757
Kind Code:
A1
Abstract:
A fluid supply system according to one aspect of the present disclosure supplies a fluid into a processing container in which a substrate is to be processed, said fluid supply system comprising: a processing fluid supply unit that supplies a processing fluid; a fluid supply path that is connected to the processing fluid supply unit and the processing container and that causes the processing fluid the temperature of which has been adjusted to flow into the processing container; a first heating mechanism that is provided to the fluid supply path and that heats the processing fluid to a first temperature; and a second heating mechanism that is provided to the fluid supply path and that heats the processing fluid to a second temperature which is lower than the first temperature, wherein the processing fluid supply unit has a flow rate adjustment mechanism that adjusts the flow rate of the processing fluid, and the fluid supply path has a first branch flow path that causes the processing fluid to pass through the first heating mechanism and flow into the processing container, and a second branch flow path that causes the processing fluid to pass through the second heating mechanism and flow into the processing container.
Inventors:
HAYASHIDA TAKAHIRO (JP)
UMEZAKI SHOTA (JP)
NAKASHIMA MIKIO (JP)
UMEZAKI SHOTA (JP)
NAKASHIMA MIKIO (JP)
Application Number:
PCT/JP2023/026064
Publication Date:
April 25, 2024
Filing Date:
July 14, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; H01L21/02
Foreign References:
| US20160334162A1 | 2016-11-17 | |||
| US20210020430A1 | 2021-01-21 | |||
| JP2021136373A | 2021-09-13 | |||
| JP2022016342A | 2022-01-21 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF: