BACKGROUND

[0001] Printing devices may include a fluid ejection device to eject a print fluid (e.g., ink) onto a substrate. In some examples, a printing device may include a fluidic die (also referred to as a printhead die) that ejects print fluid through a number of nozzles. In some examples, the fluidic die is formed from a monolithic slab of silicon with electrical components and fluidic components (e.g., nozzles) formed on the silicon. In these approaches, a flexible circuit is communicably connected to the fluidic die and is used to enable transmission of signals between a controller of the printing device and the fluidic die.

BRIEF DESCRIPTION OF THE DRAWINGS

[0002] The accompanying drawings illustrate various examples of the principles described herein and are part of the specification. The illustrated examples are given merely for illustration, and do not limit the scope of the claims.

[0003] Fig. 1 illustrates a fluidic die assembly in a front perspective view, according to an example.

[0004] Fig. 2 illustrates a fluidic die assembly in a back perspective view, according to an example.

[0005] Fig. 3 illustrates a front view of a leadframe, according to an example.

[0006] Fig. 4 illustrates a first molded portion of the fluidic die assembly, according to an example. [0007] Fig. 5 illustrates conductive support material in the leadframe that is to be removed, according to an example.

[0008] Fig. 6 illustrates first molded portions and isolated pads of the leadframe, according to an example.

[0009] Fig. 7 illustrates a second molded portion of the fluidic die assembly, according to an example.

[0010] Fig. 8 illustrates electrical connections to the fluidic die, according to an example.

[0011] Fig. 9 illustrates a protective material applied to the electrical connections, according to an example.

[0012] Fig. 10 illustrates the completed fluidic die assembly, according to an example.

[0013] Figs. 11 illustrates a fluid ejection device with the fluidic die assembly attached to a body, according to an example.

[0014] Fig. 12 illustrates a contact zone for a nozzle cap, according to an example.

[0015] Fig. 13 is a flow diagram illustrating a method for forming a fluidic die assembly, according to an example.

[0016] Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings.

DETAILED DESCRIPTION

[0017] In some approaches, a fluid ejection device includes a body forming a print fluid reservoir. In these approaches, the body is formed with a headland portion into which a fluidic die is attached. As used herein “headland” refers to a surface to which a fluidic die is attached (e.g., via an adhesive bond). In these approaches, the headland portion is formed on a lower bottom wall of the body. For example, the body may be molded from a polymer (e.g., thermoplastic resin). In this case, the headland portion is formed during the molding of the body. For instance, the headland portion may be a recess on the lower bottom wall of the body.

[0018] In these approaches, the headland is not formed separate from the body. As such, circuitry that is used to control the fluidic die may be in close proximity to the print fluid ejected from the fluidic die. This may result in reduced reliability of the circuitry due to corrosion from the print fluid. Furthermore, forming the headland on the body may result in complex molding and higher manufacturing costs. In some examples, forming the headland on the body may decrease manufacturing efficiency due to the size and complexity of the fluid ejection device body. In other cases, forming the headland on the body may decrease the efficiency of fluid and air (e.g., bubble) routing through the fluid ejection device due to mold-constrained geometry.

[0019] The present specification describes examples of a fluid ejection device with a fluidic die assembly that is formed separate from the body of the fluid ejection device. In some examples, after the body is formed (e.g., in a molding process) and the fluidic die assembly is formed (e.g., in a separate molding process), the fluidic die assembly may be coupled to the body via a fluidic interconnect. The fluidic die assembly may include a number of components (e.g., electrical connections, a fluidic die, a molded component, etc.).

[0020] In some examples, the fluidic die assembly may be formed by overmolding a leadframe to create both a headland and electrical interface. A fluidic die (e.g., an integrated inkjet printhead assembly) may be connected to the molded component. Datums, electrical connections, and a print fluid plenum may be incorporated into a single fluidic die assembly. This may simplify the manufacturing of the fluid ejection device, and may provide performance gains. [0021] In an example, the present specification describes a fluidic die assembly. The example fluidic die assembly includes a leadframe with a first plurality of electrical connection pads in a headland portion, a second plurality of electrical connection pads in an electrical interface portion, and electrical leads connecting the pads in the headland portion to the pads in the electrical interface portion. As used herein, a “headland portion” includes a region of the fluidic die assembly that includes the surface to which a fluidic die is attached. As used herein, the “electrical interface portion” includes a region of the fluidic die assembly with a number of electrical connection pads to interface with a printing device. The fluidic die assembly also includes a molded component that covers the leadframe. The molded component includes apertures to expose the first plurality of electrical connection pads, the second plurality of electrical connection pads, and a portion of the electrical leads at a bend zone between the headland portion and the electrical interface portion. The fluidic die assembly also includes a fluidic die with an electrical component. The fluidic die assembly further includes electrical connections coupling the electrical component of the fluidic die to the first plurality of electrical connection pads in the headland portion.

[0022] In another example, the present specification describes a fluid ejection device. The example fluid ejection device includes a body and a fluidic die assembly coupled to the body. The fluidic die assembly includes a leadframe with electrical connection pads and electrical leads in a headland portion and an electrical interface portion of the fluidic die assembly. The fluidic die assembly also includes a first molded portion of a molded component that covers a first portion of the leadframe. The fluidic die assembly further includes a second molded portion of the molded component that covers a second portion of the leadframe. The first molded portion and the second molded portion include apertures to expose the electrical connection pads and a portion of the electrical leads between the headland portion and the electrical interface portion. The fluidic die assembly also includes a fluidic die electrically coupled to electrical connection pads in the headland portion of the leadframe.

[0023] In yet another example, the present specification also describes a method. The example method includes forming a first molded portion of a molded component that covers a first portion of a leadframe comprising electrical connection pads in a headland portion coupled by electrical leads to electrical connection pads in an electrical interface portion. The method also includes forming a second molded portion of the molded component that covers a second portion of the leadframe, the first molded portion and the second molded portion exposing a portion of the electrical leads in a bend zone between the headland portion and the electrical interface portion of the leadframe. The method further includes coupling a fluidic die electrically to electrical connection pads in the headland portion of the leadframe.

[0024] Turning now to the figures, Fig. 1 illustrates an example of a fluidic die assembly 100 in a front perspective view. In this example, the fluidic die assembly 100 may include a headland portion 104 and an electrical interface portion 106. As will be described herein, the headland portion 104 may house the fluidic die 118 of the fluidic die assembly 100. The headland portion 104 may also include a plenum to provide a print fluid to the fluidic die 118. An example of the plenum is illustrated in Fig. 2.

[0025] It should be noted that in this example, there is a single fluidic die 118 to print using a single print fluid. In other examples, multiple fluidic dies (or a single fluidic die with multiple sets of nozzles) may be used to print using multiple print fluids. For example, a four-color fluid ejection device may use four different print fluids supplied from four separate plena. For the sake of explanation, this disclosure provides examples of a single fluidic die 118 to print with a single print fluid.

[0026] In some examples, the fluidic die 118 may include an electrical component and a fluidic architecture. The electrical component of the fluidic die 118 may include bond pads to receive control signals. For example, a printing device may provide control signals to the fluidic die 118 to control which nozzles fire. In some examples, the fluidic die 118 may be a silicon-based microelectromechanical systems (MEMS) device with a number of nozzles. The electrical bond pads of the fluidic die 118 may be aligned along the long axis of the fluidic die 118. The fluidic architecture of the fluidic die 118 may receive a print fluid and may provide the print fluid to the nozzles of the fluidic die 118. [0027] In some examples, the fluidic die assembly 100 includes a leadframe 102 that provides electrical circuits in the fluidic die assembly 100. As used herein, a “leadframe” includes a number of metal conductors (referred to as leads or lines) that provide pads (e.g., bond pads) to different locations of the fluidic die assembly 100. The leadframe 102 may be formed from a single conductive panel. The leadframe 102 may carry signals from the printing device to the fluidic die 118. In some examples, the leadframe 102 may provide electrical power (e.g., electrical current and voltage) and a ground to the fluidic die 118.

[0028] The leadframe 102 may include a first plurality of electrical connection pads 108 in the headland portion 104. For example, the first plurality of electrical connection pads 108 may be bond pads to interface with bond pads of the fluidic die 118. In some examples, electrical connections 120 may couple the electrical component of the fluidic die 118 to the first plurality of electrical connection pads 108 in the headland portion 104. For example, the electrical connections 120 may include wirebonds between the bond pads of the fluidic die 118 and the first plurality of electrical connection pads 108.

[0029] In some examples, the leadframe 102 may include a second plurality of electrical connection pads 110 in the electrical interface portion 106 of the fluidic die assembly 100. The electrical interface portion 106 may include a number of electrical connection pads 110 to interface with a printing device. In some examples, the electrical connection pads 110 of the electrical interface portion 106 may communicate with an interface (e.g., a dimple flex) of the printing device.

[0030] In some examples, electrical leads 112 may connect the first plurality of electrical connection pads 108 and the second plurality of electrical connection pads 110. The electrical leads 112 may include electrical circuits formed in the leadframe 102 that form electrical connections between the first plurality of electrical connection pads 108 and the second plurality of electrical connection pads 110.

[0031] The fluidic die assembly 100 may include a molded component 114 that covers the leadframe 102. In some examples, the molded component 114 may be a polymer (e.g., thermoplastic resin). The molded component 114 may be formed on the leadframe 102 in an over-molding process. The molded component 114 may include apertures 115 to expose the first and second plurality of electrical connection pads 108, 110 of the leadframe 102. For example, during molding, the molded component 114 may be kept away from (and therefore not cover) the electrical connection pads 108, 110 such that the electrical connection pads 108, 110 are uncovered.

[0032] In some examples, the apertures 115 of the molded component 114 may expose a portion of the electrical leads 112 at a bend zone 116 between the headland portion 104 and the electrical interface portion 106. For example, a portion of the electrical leads 112 in the bend zone 116 may be left bare during the molding of the molded component 114. The exposed electrical leads 112 in the bend zone 116 may allow the electrical interface portion 106 to be positioned at an angle relative to the headland portion 104. This bend may allow the electrical interface portion 106 to attach to a body of the fluid ejection device.

[0033] In some examples, the molded component 114 may include a first molded portion formed in a first molding process and a second molded portion formed in a second molding process. As used herein, a “molding process” includes the injection of a molding compound into a mold to form an object. The first molding process occurs separate from the second molding process. For example, the first molding process may use a first mold and the second molding process may use a second mold. In an example, a first set of over-molded features may be formed by a first molding process (also referred to as a first shot molding or first shot). A second set of over-molded features may be formed by a second molding process (also referred to as a second shot molding or second shot). Examples of a dual-molding approach to forming the molded component 114 are described below. [0034] In some examples, pen datums may be formed in the molded component 114 as part of the fluidic die assembly 100. A pen datum may include a feature that is used to orient and position the fluidic die 118 within the printing device. This may allow the fluidic die 118 to be more accurately located with respect to the printing device, which may yield better print accuracy.

[0035] In the examples described herein, the electrical signal/power connections may be integrated with the over-molded fluidic die assembly 100. The electrical connections to the printing device interface may be more accurate relative to the pen datums, yielding a more reliable electrical connection. For example, as the signals pass through sizable conductors that are spaced a threshold distance (e.g., 600 micrometers) apart, the reliability of the electrical signals may be increased as there is less likelihood of corrosion and associated shorting.

[0036] In some examples, the leadframe 102 may allow for more aggressive print fluids than a flexible circuit-based design. In the examples herein, there are no unprotected electrical leads 112 under the fluidic die 118 when the fluidic die assembly 100 is in an installed orientation in a printing device. Furthermore, the electrical leads 112 in the bend zone 116 may be encapsulated (e.g., with a protective material). The molded component 114 in the electrical interface portion 106 may also protect the electrical leads 112 and pads 110.

[0037] In some examples, the electrical connection pads 110 in the electrical interface portion 106 may be made larger than those of a flexible circuit. This may allow for a looser locational tolerance for the electrical interface with the printing device. These electrical connection pads 110 may also be able to tolerate more cycling than a flexible circuit-based design.

[0038] The electrical interface described herein may separate high voltage power and associated power return ground from a sensitive analog signal line. This may minimize noise that could affect accurate fluidic die measurements. Due to adequate space availability for the electrical lead routing, the power and power ground current loop may be kept well away from a signal line and low- power digital/analog current loop. This may avoid current coupling. [0039] Fig. 2 illustrates an example of a fluidic die assembly 100 in a back perspective view. In this example, the molded component 114 forms various parts of the fluidic die assembly 100. For example, the molded component 114 may form a fluidic interface 219 and a plenum 220 to provide print fluid from the body to the fluidic die of the fluidic die assembly 100. The plenum 220 may be formed (e.g., molded) on the headland portion 104 of the fluidic die assembly 100. The fluidic interface 219 may be coupled (e.g., via an adhesive) to a print fluid reservoir.

[0040] In this example, the electrical interface portion 106 is shown in an angled (e.g., bent) position relative to the headland portion 104.

[0041] Examples of various stages of manufacturing the fluidic die assembly 100 are now described. Fig. 3 illustrates a front view of the leadframe 102 formed on a panel 322. In some examples, the fluidic die assembly 100 may be fabricated on a panel 322. The completed fluidic die assembly 100 may be removed from the panel 322.

[0042] In some examples, the panel 322 may be a sheet of electrically conductive material (e.g., an alloy sheet). For example, the panel 322 may be flat plate of copper, a copper-alloy, an iron-nickel alloy, etc. The leadframe 102 may be formed by removing portions of the panel 322. For example, the leadframe 102 may be chemically etched using photolithography due to small feature sizes. In other examples, the leadframe 102 may be punched out of the panel 322. In some examples, the panel 322 may be gold plated to enable wirebonds.

[0043] In Fig. 3, electrical connection pads 108, 110 are formed in the leadframe 102. Electrical leads 112 may connect the electrical connection pads 108, 110. It should be noted that to support the electrical leads 112, the electrical connection pads 108 may be connected with a portion of the panel 322 to stabilize the connection pads 108 and electrical leads 112 during to molding process. This stabilizing material may be removed in a later stage (as described in Fig. 5). The leadframe 102 may form the electrical connection pads 108 and electrical leads 112 of the fluidic die assembly. [0044] In Fig. 4, a first molded portion of a molded component may cover a first portion of the leadframe 102. In this example, the first molded portions 414a,b may be formed by a first shot over-mold of the panel 322 and leadframe 102. For example, the panel 322 with leadframe 102 may be loaded into first shot mold. As used herein, the term “shot” refers to the injection of a liquid material into a mold. The mold may be closed and a first shot is over-molded. [0045] The first molded portion may stabilize the electrical connection pads and electrical leads of the leadframe 102 during molding of the molded component on the leadframe 102. The leadframe 102 is stabilized and captured by the first molded portions 414a, b.

[0046] In this example, a headland molded portion 414a is molded in the headland portion of the leadframe 102. An electrical interface molded portion 414b is molded in the electrical interface portion of the leadframe 102. It should be noted that the first molded portions 414a,b leave portions of the electrical leads 112 exposed. Leaving the electrical leads 112 exposed may avoid causing the electrical leads to contact during molding due to the molding forces on the electrical leads 112.

[0047] In this example, a first shot headland mold gate 415 and a first shot electrical interface gate 417 are attached to the panel 322. The mold gates 415, 417 may stabilize the first molded portions 414a,b and leadframe 102.

[0048] Fig. 5 illustrates conductive support material 530 in the leadframe 102 that is to be removed. As described above, the leadframe 102 may be formed in the panel 322 by leaving conductive support material 530 between the first plurality of electrical connection pads in the headland portion. The conductive support material 530 may stabilize the electrical connection pads and electrical leads in the headland portion during molding. Thus, Fig. 5 illustrates the conductive support material 530 that is to be removed after the first molded portion 414a is molded to the leadframe 102.

[0049] After the first shot molding is complete, the leadframe 102 may be punched to un-short (e.g., remove the conductive support material 530) the leads in leadframe 102. Thus, after the first shot is over-molded, the conductive support material 530 of the panel 322 and leadframe 102 may be removed to isolate the various electrical leads. It should be noted that removing the conductive support material 530 may be done prior to the second shot overmold as these areas will be occluded by the second shot.

[0050] Fig. 6 illustrates the first molded portions 414a,b and isolated pads 108 of the leadframe 102. After the conductive support material 530 is removed (e.g., punched out) from selected areas on leadframe 102, the electrical connection pads 108 of the leadframe 102 may be isolated.

[0051] Fig. 7 illustrates a second molded portion of the fluidic die assembly 100. In Fig. 7, second molded portions 714a,b may be applied to the panel 322 after isolation of the pads 108 described in Fig. 6. Thus, Fig. 7 illustrates additional material that may be molded to cover additional portions of the panel 322.

[0052] In this example, a second shot over-mold of the panel 322 may form the second molded portions 714a, b. For example, the panel 322 with the leadframe 102 and the first molded portions 414a,b may be loaded into a second shot mold. The second shot mold may be closed and a second shot is over-molded. The first shot may be interlocked with the second shot.

[0053] The second molded portions 714a,b may cover a second portion of the leadframe 102. The first molded portions 414a,b and the second molded portions 714a, b may form apertures to expose the electrical connection pads 108, 110 and a portion of the electrical leads 112 between the headland portion and the electrical interface portion.

[0054] In this example, a second shot headland mold gate 715 and a second shot electrical interface gate 717 are attached to the panel 322. The mold gates 715, 717 may stabilize the second molded portions 714a, b and leadframe 102. [0055] In some examples, four tabs 736 formed by the second molded portion 714a may attach the leadframe 102 to the panel 322 in the headland portion. Two tabs 738 formed by the second molded portion 714b may attach the leadframe 102 to the panel 322 in the electrical interface portion.

[0056] In some examples, the molded component forms a pen datum to align the fluidic die with a printing device. In the example of Fig. 7, three pen datums 734 are formed by the second molded portion 714a. Because the pen datums 734 are integrated with the headland portion of the fluidic die assembly 100, the fluidic die may be accurately located with respect to the printing device.

[0057] In some examples, the molded component forms a housing 732 for the fluidic die. In this example, the second molded portion 714a forms the fluidic die housing 732 as a recess in the headland portion of the fluidic die assembly 100. The fluidic die housing 732 may be aligned with respect to the pen datums 734.

[0058] In some examples, the plenum and an opening to the fluidic die may be formed by the second molded portion 714a. For example, a slot may be formed in the floor of the fluidic die housing 732 to allow print fluid to flow from the plenum into the fluidic die.

[0059] The second molded portions 714a,b may complete the over-molding. Upon completion of the over-molding, the fluidic die 118 may be attached to the fluidic die housing 732. For example, an adhesive may be used to secure the fluidic die 118 to the headland portion. The adhesive may also provide a seal to the plenum on the headland portion. In some examples, vision targets on the panel 322 may be used to align and attach the fluidic die 118 to the fluidic die housing 732.

[0060] Fig. 8 illustrates electrical connections 120 to the fluidic die 118. While the fluidic die assembly 100 is still attached to the panel 322, the fluidic die 118 may be electrically coupled to electrical connection pads 108 in the headland portion of the leadframe 102. For example, a wirebond 840 may couple an electrical connection pad 108 of the leadframe 102 to a fluidic die pad 842.

[0061] Fig. 9 illustrates a protective material 950 applied to the electrical connections 120. In some examples, a protective material 950 may be overlaid on the electrical connections 120 coupling the electrical component (e.g., fluidic die pad 842) of the fluidic die 118 to the first plurality of electrical connection pads 108. In some examples, the protective material 950 may be an encapsulation adhesive. In some examples, the protective material 950 is applied while the fluidic die assembly 100 is still attached to the panel 322. In some examples, the protective material 950 is applied while the fluidic die assembly 100 is removed from (e.g., detached from) the panel 322. In some examples, a portion of the protective material 950 is applied while the fluidic die assembly 100 is attached to the panel 322 and a second portion of the is applied while the fluidic die assembly 100 is removed from (e.g., detached from) the panel 322.

[0062] Fig. 10 illustrates the completed fluidic die assembly 100 removed from the panel. In this example, portions of the leadframe 102 connected to the panel are detached from the panel. The fluidic die assembly 100 may be separated from the tabs (e.g., 736, 738), and mold gates (e.g., 415, 417, 715, 715) connecting the molded component to the panel. It should be noted that the electrical interface portion 106 may be in plane with the headland portion 104 at this stage. Upon the headland portion 104 being attached to a body with the print fluid reservoir, the electrical interface portion 106 may be bent to attach to a side of the body.

[0063] Fig. 11 illustrates a fluid ejection device 1151 with the fluidic die assembly 100 attached to a body 1152. In Fig. 11 , the body 1152 may form a print fluid reservoir.

[0064] In some examples, adhesive may be applied to the body 1152 to secure the fluidic die assembly 100 and form a fluidic joint (e.g., at the fluidic interface of the plenum). The headland portion 104 of the fluidic die assembly 100 may be aligned and attached to the body 1152. The adhesive may be cured to secure the fluidic die assembly 100 to the body 1152.

[0065] The electrical interface portion 106 of the fluidic die assembly 100 may be bent and pressed into place onto the body 1152. In some examples, tooling holes formed on the electrical interface portion 106 may be used for bend positional control.

[0066] In some examples, the portion of the electrical leads in the bend zone between the headland portion 104 and the electrical interface portion 106 may be encapsulated with a protective material 1156. For example, an encapsulation adhesive may be applied to the bent and exposed electrical leads to protect the electrical leads from print fluid and mechanical damage.

[0067] In another example, the electrical leads in the bend zone may be over-molded with a thin, bendable portion of the molded component to form a bendable bridge. This bendable bridge may be formed during the first molding process or the second molding process while the fluidic die assembly 100 is attached to the panel 322.

[0068] Fig. 12 illustrates an example of a contact zone 1258 for a nozzle cap. In some examples, the printing device may include a nozzle cap (also referred to as a cap) to seal the nozzles of the fluidic die 118 when the fluidic die assembly 100 is not being used for printing.

[0069] In some examples, the first molded portion 414a may form the contact zone 1258 for the nozzle cap to seal the fluidic die. The contact zone 1258 may be formed separately from the second molded portion 714a. In some examples, the first molded portion 414a may provide a contiguous surface for the nozzle cap. The contact zone may be free of molding flash. It should be noted that with molding, flash is likely to occur wherever there is a transition from a feature formed in a first shot to a feature formed in a second shot. With the seal contact zone 1258 located over the first molded portion 414a while avoiding the second molded portion 714a, flash interruptions may not cause leaks leading to decapping of the nozzles.

[0070] Fig. 13 is a flow diagram illustrating a method 1300 for forming a fluidic die assembly 100. At 1302, a first molded portion of a molded component 114 may be formed (e.g., such as described with reference to Figs. 3-6). The first molded portion may cover a first portion of the leadframe 102. For example, a leadframe 102 of a fluidic die assembly 100 may be formed from a conductive panel 322. The leadframe 102 may include electrical connection pads 108 in a headland portion 104 coupled by electrical leads 112 to electrical connection pads 110 in an electrical interface portion 106. The first molded portion may stabilize the electrical connection pads 108, 110 and the electrical leads 112 during molding of the molded component 114 on the leadframe 102. In some examples, the first molded portion may form apertures that expose the electrical connection pads 108, 110 and a portion of the electrical leads 112.

[0071] At 1304, a second molded portion of the molded component 114 may be formed (e.g., such as described with reference to Fig. 7). The second molded portion may cover a second portion of the leadframe 102. An aperture in the first molded portion and the second molded portion may expose a portion of the electrical leads 112 in a bend zone 116 between the headland portion 104 and the electrical interface portion 106.

[0072] At 1306, a fluidic die 118 may be electrically coupled to the electrical connection pads 108 in the headland portion 104 of the leadframe 102 (e.g., such as described with reference to Fig. 8). For example, a wirebond 840 may connect an electrical connection pad 108 of the leadframe 102 to a fluidic die pad 842.

[0073] In some examples, a portion of the leadframe 102 in the headland portion 104 may be removed to eliminate conductive support material 530 between the electrical leads 112 (e.g., such as described with reference to Figs. 5-6). The conductive support material 530 may be removed after molding the first molded portion at 1304 and prior to molding the second molded portion at 1306.

[0074] In some examples, the fluidic die assembly 100 may be removed from the conductive panel 322 (e.g., such as described with reference to Fig. 9). The headland portion 104 of the fluidic die assembly 100 may be attached to a body 1152 of a fluid ejection device 1151 (e.g., such as described with reference to Fig. 10). The portion of the electrical leads 112 in the bend zone 116 between the headland portion 104 and the electrical interface portion 106 may be bent to allow the electrical interface portion 106 to attach to the body 1152.

[0075] In some examples, the portion of the electrical leads 112 in the bend zone 116 between the headland portion 104 and the electrical interface portion 106 may be encapsulated with a protective material 1156 (e.g., such as described with reference to Fig. 10). In some examples, the portion of the electrical leads 112 in the bend zone 116 between the headland portion104 and the electrical interface portion 106 may be over-molded with a bendable portion of the molded component 114.