FLUIDIC SUBSTANCE PACKAGING BODY - IDEMITSU UNITECH CO LTD

Title:

FLUIDIC SUBSTANCE PACKAGING BODY

Document Type and Number:

WIPO Patent Application WO/2003/074389

Kind Code:

A1

Abstract:

A fluidic substance packaging body (1) comprises a pair of molded bodies (10, 20) having recesses (11, 21) of substantially the same sectional shape for filling a fluidic substance. The pair of molded bodies (10, 20) have their recesses (11, 21) disposed to be opposed to each other and are connected together by flanges (12, 22) formed along the peripheral edges of the recesses (11, 21). One molded body (10) is made of a hard material having a hardness such that when manual gripping force is applied to the molded body from outside the packaging body (1) in a direction to crush the recess (11), it will not deform. The other molded body (20) is made of a flexible material that is deformed by the gripping force.

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Inventors:

YASUIKE TETSUROU (JP)

Application Number:

PCT/JP2003/002488

Publication Date:

September 12, 2003

Filing Date:

March 04, 2003

Export Citation:

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Assignee:

IDEMITSU UNITECH CO LTD (JP)
YASUIKE TETSUROU (JP)

International Classes:

B65D75/26; B65D75/32; B65D75/62; B65D75/64; (IPC1-7): B65D83/00; B65D77/32

Foreign References:

JPS51143481A	1976-12-09
JPH082553A	1996-01-09

Attorney, Agent or Firm:

Kinoshita, Jitsuzo (Ogikubo TM building 26-13, Ogikubo 5-chom, Suginami-ku Tokyo, JP)

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