Title:
FLUORESCENT CHIP AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/006891
Kind Code:
A1
Abstract:
A fluorescent chip and a manufacturing method therefor. The fluorescent chip comprises: a substrate (101); a first reflective layer (102) disposed on the substrate (101); and a second reflective layer (103) disposed on the first reflective layer (102) and enclosing a plurality of planar-arranged accommodating cavities, the second reflective layer (103) constituting sidewalls of the accommodating cavities, each of the accommodating cavities being internally provided with a light emitting unit (104), and the upper surface of each of the light emitting units (104) being not higher than the plane on which openings of the accommodating cavities are located. The surfaces of the light emitting units (104) in the fluorescent chip other than the upper surface are all blocked by a reflective material, such that illumination of each of the light emitting units (104) does not affect an adjacent light emitting unit (104), avoiding occurrence of color mixture and similar phenomena.
Inventors:
LI QIAN (CN)
XU YANZHENG (CN)
XU YANZHENG (CN)
Application Number:
PCT/CN2017/103426
Publication Date:
January 10, 2019
Filing Date:
September 26, 2017
Export Citation:
Assignee:
APPOTRONICS CORP LTD (CN)
International Classes:
H01S5/028; H01S3/02
Foreign References:
| CN105990505A | 2016-10-05 | |||
| CN103339563A | 2013-10-02 | |||
| CN103733243A | 2014-04-16 | |||
| CN106887505A | 2017-06-23 | |||
| US5182669A | 1993-01-26 |
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