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Patent Searching and Data


Title:
FLUORINATED COPOLYMER, ELECTRIC WIRE, AND METHOD FOR PRODUCTION OF THE ELECTRIC WIRE
Document Type and Number:
WIPO Patent Application WO/2008/047906
Kind Code:
A1
Abstract:
Disclosed is a fluorinated copolymer which can reduce molding defects occurring during the coating and molding of an electric wire and can improve the cracking resistance of the electric wire. Also disclosed is a method for producing an electric wire, which can reduce defects occurring during molding to a large extent. Further disclosed is an electric wire having improved cracking resistance. The fluorinated copolymer essentially comprises a constituent unit derived from tetrafluoroethylene and additionally comprises a constituent unit derived from hexafluoropropylene and/or perfluoro(alkyl vinyl ether). When the fluorinated copolymer is molded into a film, the film has 10000 or less fish-eyes per 100 g each having such a size that a piece of 44 μm squared can be enclosed but a piece of 178 μm squared cannot be enclosed in each of the fish-eyes, and has 1000 or less fish-eyes per 100 g each having such a size that a piece of 178 μm squared can be enclosed in each of the fish-eye.

Inventors:
ISHII, Kenji (Yodogawa Plant, 1-1Nishihitotsuya, Settsu-sh, Osaka 85, 5668585, JP)
石井健二 (〒85 大阪府摂津市西一津屋1番1号 ダイキン工業株式会社淀川製作所内 Osaka, 5668585, JP)
KONO, Hideki (Yodogawa Plant, 1-1Nishihitotsuya, Settsu-sh, Osaka 85, 5668585, JP)
Application Number:
JP2007/070444
Publication Date:
April 24, 2008
Filing Date:
October 19, 2007
Export Citation:
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Assignee:
DAIKIN INDUSTRIES, LTD. (Umeda Center Building, 4-12 Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-Sh, Osaka 23, 5308323, JP)
ダイキン工業株式会社 (〒23 大阪府大阪市北区中崎西2丁目4番12号 梅田センタービル Osaka, 5308323, JP)
ISHII, Kenji (Yodogawa Plant, 1-1Nishihitotsuya, Settsu-sh, Osaka 85, 5668585, JP)
石井健二 (〒85 大阪府摂津市西一津屋1番1号 ダイキン工業株式会社淀川製作所内 Osaka, 5668585, JP)
International Classes:
C08F214/26; H01B3/44; H01B7/02; H01B13/14
Attorney, Agent or Firm:
YASUTOMI, Yasuo (MT-2 BLDG, 5-36 Miyahara 3-chome,Yodogawa-ku, Osaka-shi, Osaka 03, 5320003, JP)
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