Title:
FLUORINE-CONTAINING COMPOUND HAVING UNSATURATED BOND AND MOLD RELEASE AGENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/137080
Kind Code:
A1
Abstract:
The present invention provides a mold release agent that has excellent releasability and durability by using a fluorine-containing compound which is composed of a perfluoroalkyl group having 6 or less carbon atoms, and which is considered to have low bioaccumulation potential. The present invention uses: a fluorine-containing compound which is represented by general formula (1); and a mold release agent which contains this fluorine-containing compound.
(1): Rf1-CH=CH-Rf2-(CH2)n-X
(In formula (1), Rf1 represents a perfluoroalkyl group having 1-6 carbon atoms; Rf2 represents a perfluoroalkylene group having 1-6 carbon atoms; n represents an integer of 1-4; and X represents a group represented by general formula (2).)
(2): -P(=O)(OM1)(OM2)
(In formula (2), each of M1 and M2 independently represents a hydrogen atom, a metal atom, an ammonium, an organic ammonium or an alkyl group having 1-4 carbon atoms.)
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Inventors:
SHIRAI TOMOHIRO (JP)
INOUE TAKAHIRO (JP)
INOUE TAKAHIRO (JP)
Application Number:
PCT/JP2019/039661
Publication Date:
July 02, 2020
Filing Date:
October 08, 2019
Export Citation:
Assignee:
TOSOH FINECHEM CORP (JP)
International Classes:
C07F9/38; B29C33/60; C07F9/40; C09K3/00
Domestic Patent References:
WO2017119371A1 | 2017-07-13 | |||
WO2011055609A1 | 2011-05-12 |
Foreign References:
JPS58180597A | 1983-10-22 | |||
JP2010214598A | 2010-09-30 |
Attorney, Agent or Firm:
HAGI, Norio (JP)
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