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Title:
FLUOROPOLYMER AND CURABLE FLUORINATED RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/096371
Kind Code:
A1
Abstract:
Disclosed are a curable fluoropolymer that exhibits superior heat stability characteristics and thermal adhesion characteristics when cured, and a curable fluorinated resin composition that contains said fluoropolymer. Specifically disclosed is a fluoropolymer that has a polymerizable double bond, said fluoropolymer being characterized in that the fluoropolymer is a copolymer which has a repeating unit derived from fluoromonoene (a) and a repeating unit derived from fluorodiene (b) that has a residual unsaturated side chain, and in that an amide group is present at the terminal of the main chain. Also disclosed is a curable fluorinated resin composition that includes the fluoropolymer.

Inventors:
SUGIYAMA NORIHIDE (JP)
OHKURA MASAHIRO (JP)
Application Number:
JP2011/051956
Publication Date:
August 11, 2011
Filing Date:
January 31, 2011
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
SUGIYAMA NORIHIDE (JP)
OHKURA MASAHIRO (JP)
International Classes:
C08F8/30; C08F299/00
Domestic Patent References:
WO2009096342A12009-08-06
WO2002088227A12002-11-07
Foreign References:
JPH06248026A1994-09-06
JPS6198709A1986-05-17
JPH01115933A1989-05-09
JPH09183812A1997-07-15
JPH0420507A1992-01-24
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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