Title:
FLUORORESIN COMPOSITION, FLUORORESIN SHEET, MULTILAYER BODY AND SUBSTRATE FOR CIRCUITS
Document Type and Number:
WIPO Patent Application WO/2020/145133
Kind Code:
A1
Abstract:
[Problem] To provide a fluororesin composition which exhibits excellent adhesion, while having low linear expansion coefficient. [Solution] A fluororesin composition which contains a melt moldable fluororesin and silica, and which is configured such that: the fluororesin has 25 or more carbonyl group-containing functional groups per 106 carbon atoms in the main chain; the silica is spherical silica; and the linear expansion coefficient of the composition is 100 ppm/°C or less.
Inventors:
KOMORI HIROKAZU (JP)
YOSHIMOTO HIROYUKI (JP)
KOMORI MASAJI (JP)
UEDA YUKI (JP)
TERADA JUNPEI (JP)
YOSHIMOTO HIROYUKI (JP)
KOMORI MASAJI (JP)
UEDA YUKI (JP)
TERADA JUNPEI (JP)
Application Number:
PCT/JP2019/050635
Publication Date:
July 16, 2020
Filing Date:
December 24, 2019
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
B32B17/10; B32B15/082; C08K3/36; C08L27/12; H05K1/03
Domestic Patent References:
| WO2016021666A1 | 2016-02-11 | |||
| WO2012099132A1 | 2012-07-26 | |||
| WO2016021666A1 | 2016-02-11 |
Foreign References:
| JP2014223799A | 2014-12-04 | |||
| JP2008265069A | 2008-11-06 | |||
| JP2010285523A | 2010-12-24 | |||
| JP2016023294A | 2016-02-08 | |||
| JP2010253729A | 2010-11-11 | |||
| US0036396A | 1862-09-09 | |||
| JP2017224758A | 2017-12-21 |
Other References:
See also references of EP 3909758A4
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
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