Title:
FLUX COMPOSITION, SOLDER PASTE COMPOSITION, AND ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/003820
Kind Code:
A1
Abstract:
The purpose of the invention is to provide a flux composition and a solder paste composition capable of ensuring excellent printability regardless of the thickness and opening diameter of a metal mask without impairing solderability (the suppression of creation of voids and solder balls), and also capable of achieving the reliability of flux residue (the adhesiveness and insulation resistance of the residue). To achieve this purpose, this flux composition comprises (A) a base resin, (B) an activator, and (C) a paraffin wax, the flux composition being characterized in that: the paraffin wax (C) includes from 9 mass% to 20 mass% of isoparaffin and/or cycloparaffin; and the amount of the paraffin wax (C) blended is from 0.5 mass% to 20 mass% with respect to the total amount of the flux composition.
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Inventors:
ARAI MASAYA (JP)
KATSUYAMA TSUKASA (JP)
NAKANO TAKESHI (JP)
HORI ATSUSHI (JP)
MUNEKAWA YURIKA (JP)
KATSUYAMA TSUKASA (JP)
NAKANO TAKESHI (JP)
HORI ATSUSHI (JP)
MUNEKAWA YURIKA (JP)
Application Number:
PCT/JP2017/023653
Publication Date:
January 04, 2018
Filing Date:
June 27, 2017
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00; C22C13/02
Foreign References:
| JP2013071152A | 2013-04-22 | |||
| JP2005021958A | 2005-01-27 | |||
| JP2015208770A | 2015-11-24 | |||
| JPH07132395A | 1995-05-23 | |||
| JP4396162B2 | 2010-01-13 | |||
| JP2013071152A | 2013-04-22 |
Other References:
See also references of EP 3335829A4
Attorney, Agent or Firm:
OTA Yoko (JP)
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