Title:
FLUX FOR NO-CLEAN GOLD-TIN SOLDERING PASTE, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/179805
Kind Code:
A1
Abstract:
A flux for a no-clean gold-tin soldering paste, comprising the following components by weight percentage: 2% ~ 5% of rosin polyurethane; 2% ~ 6% of a polyurethane film former; 3% ~ 8% of a thixotropic agent; 1% ~ 5% of an active agent; and the remaining are a solvent. The flux does not contain halogen, has good physical stability, has a high spread rate, matches well with gold-tin solder, is non-corrosive, has good solder joint appearance, and is excellent in soldering performance; said flux can be used in high-brightness or high-power LED packaging, and ensures the reliability of electronic product packaging. Further related is a flux for a no-clean gold-tin soldering paste, a use of the flux for a no-clean gold-tin soldering paste in preparing the no-clean gold-tin soldering paste, the no-clean gold-tin soldering paste, a preparation method for the no-clean gold-tin soldering paste, and an application of the no-clean gold-tin soldering paste.
Inventors:
CHEN WEIMIN (CN)
YANG QINGSONG (CN)
HUANG JIEFEI (CN)
YANG QINGSONG (CN)
HUANG JIEFEI (CN)
Application Number:
PCT/CN2023/095438
Publication Date:
September 28, 2023
Filing Date:
May 22, 2023
Export Citation:
Assignee:
GUANGZHOU XIANYI ELECTRONIC TECH CO LTD (CN)
International Classes:
B23K35/363; B23K1/00; B23K35/26
Foreign References:
| CN114378483A | 2022-04-22 | |||
| CN111390423A | 2020-07-10 | |||
| CN109014484A | 2018-12-18 | |||
| CN112719694A | 2021-04-30 | |||
| US20120067629A1 | 2012-03-22 | |||
| US5167729A | 1992-12-01 |
Attorney, Agent or Firm:
YOGO PATENT AND TRADEMARK AGENCY LIMITED COMPANY (CN)
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