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Patent Searching and Data


Title:
FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/043959
Kind Code:
A1
Abstract:
The flux according to the present invention contains at least one liquid solvent that is a liquid at normal temperature and has at least one hydroxy group, and contains at least two solid solvents that are solid at normal temperature and have at least one hydroxy group. The content of each solid solvent is less than 40 mass% with reference to the total content of the liquid solvent and the solid solvent.

Inventors:
FURUSAWA, Mitsuyasu (32-1 Senju-asahi-cho, Adachi-k, Tokyo 26, 〒1200026, JP)
Application Number:
JP2017/035800
Publication Date:
March 07, 2019
Filing Date:
October 02, 2017
Export Citation:
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Assignee:
KOKI COMPANY LIMITED (32-1, Senju-asahi-cho Adachi-k, Tokyo 26, 〒1200026, JP)
International Classes:
B23K35/363; H05K3/34
Foreign References:
JPH0687090A1994-03-29
JP2004025305A2004-01-29
JP2006289497A2006-10-26
JP2009542019A2009-11-26
JPH0994691A1997-04-08
JP2017192987A2017-10-26
Attorney, Agent or Firm:
FUJIMOTO, Noboru (Sakaisuji-Inabata Bldg. 2F, 15-14 Minamisemba 1-chome, Chuo-ku, Osaka-sh, Osaka 81, 〒5420081, JP)
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