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Patent Searching and Data


Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2019/074006
Kind Code:
A1
Abstract:
Provided are a flux which has improved wet-spreadability and is capable of preventing the occurrence of dewetting and a solder paste with the use of the flux. The flux comprises one member selected from among a dimer acid that is a product of a reaction between oleic acid and linolic acid, a trimer acid that is a product of a reaction between oleic acid and linolic acid, a hydrogenated dimer acid prepared by adding hydrogen to a dimer acid that is a product of a reaction between oleic acid and linolic acid and a hydrogenated trimer acid prepared by adding hydrogen to a trimer acid that is a product of a reaction between oleic acid and linolic acid, or two or more members selected from among a dimer acid that is a product of a reaction between oleic acid and linolic acid, a trimer acid that is a product of a reaction between oleic acid and linolic acid, a hydrogenated dimer acid prepared by adding hydrogen to a dimer acid that is a product of a reaction between oleic acid and linolic acid and a hydrogenated trimer acid prepared by adding hydrogen to a trimer acid that is a product of a reaction between oleic acid and linolic acid in a total amount of 0.5-20 wt% inclusive. The solder paste comprises the flux and a metal powder.

Inventors:
TAKAGI YOSHINORI (JP)
KAWASAKI HIROYOSHI (JP)
NISHIZAKI TAKAHIRO (JP)
Application Number:
JP2018/037764
Publication Date:
April 18, 2019
Filing Date:
October 10, 2018
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Foreign References:
JP2017064761A2017-04-06
JP2013169557A2013-09-02
JP2017088827A2017-05-25
JP2007532321A2007-11-15
JP2013173184A2013-09-05
JP2014185298A2014-10-02
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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