Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2019/142772
Kind Code:
A1
Abstract:
Provided is flux that can achieve a low residue so as to make it possible to ensure wetness of solder, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without cleaning. The flux includes 1-15% by weight of an organic acid mixture comprising a C10 or higher organic acid, 50-90% by weight of iso-bornyl cyclohexanol, and 5-45% by weight of another solvent. The proportion of the iso-bornyl cyclohexanol is 50-95% by weight, where 100% by weight is the total of the iso-bornyl cyclohexanol and the other solvent. The organic acid mixture comprising the C10 or higher organic acid comprises 2-methylnonanedioic acid, 4-(methoxycarbonyl)-2,4-dimethylundecanedioic acid, 4,6-bis(methoxycarbonyl)-2,4,6-trimethyldecanedioic acid, and 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid.
Inventors:
KAWANAGO TOMOHISA (JP)
HIRAOKA MIYUKI (JP)
NISHIZAKI TAKAHIRO (JP)
KAWASAKI HIROYOSHI (JP)
SHIRATORI MASATO (JP)
HIRAOKA MIYUKI (JP)
NISHIZAKI TAKAHIRO (JP)
KAWASAKI HIROYOSHI (JP)
SHIRATORI MASATO (JP)
Application Number:
PCT/JP2019/000891
Publication Date:
July 25, 2019
Filing Date:
January 15, 2019
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Domestic Patent References:
| WO2017047694A1 | 2017-03-23 | |||
| WO2015146473A1 | 2015-10-01 |
Foreign References:
| JP2015142936A | 2015-08-06 | |||
| JPS61501377A | 1986-07-10 | |||
| JP2017056485A | 2017-03-23 |
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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