Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2019/142802
Kind Code:
A1
Abstract:
Provided are flux that includes a heat-resistant activator having low reactivity with thermosetting resins, and a solder paste in which the flux is used. This flux includes 30-70 wt% of a thermosetting resin, 3-15 wt% of an amine, and 5-20 wt% of: a dimer acid that is a reaction product of oleic acid and linoleic acid; a trimer acid that is a reaction product of oleic acid and linoleic acid; a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid that is a reaction product of oleic acid and linoleic acid; a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid that is a reaction product of oleic acid and linoleic acid; or two or more from among a dimer acid that is a reaction product of oleic acid and linoleic acid, a trimer acid that is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid that is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid that is a reaction product of oleic acid and linoleic acid.
Inventors:
KAJIKAWA YASUHIRO (JP)
SUGII HIROSHI (JP)
KAWASAKI HIROYOSHI (JP)
HIRAOKA YOSHINORI (JP)
SUGII HIROSHI (JP)
KAWASAKI HIROYOSHI (JP)
HIRAOKA YOSHINORI (JP)
Application Number:
PCT/JP2019/001016
Publication Date:
July 25, 2019
Filing Date:
January 16, 2019
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Domestic Patent References:
WO2018003820A1 | 2018-01-04 |
Foreign References:
JP2015511888A | 2015-04-23 | |||
JP2016181599A | 2016-10-13 | |||
JP2013188761A | 2013-09-26 | |||
JP2007532321A | 2007-11-15 | |||
JP2008300443A | 2008-12-11 | |||
JP2018008287A | 2018-01-18 |
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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