Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2020/031693
Kind Code:
A1
Abstract:
This flux contains a solvent and a thixotropic agent, wherein the solvent contains a carboxylic acid that is a liquid at ordinary temperature.
Inventors:
YAHAGI TAKESHI (JP)
UCHIDA NORIYOSHI (JP)
MISUMI YURI (JP)
UCHIDA NORIYOSHI (JP)
MISUMI YURI (JP)
Application Number:
PCT/JP2019/028961
Publication Date:
February 13, 2020
Filing Date:
July 24, 2019
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Domestic Patent References:
WO2019142802A1 | 2019-07-25 | |||
WO2009069601A1 | 2009-06-04 |
Foreign References:
JP2015142936A | 2015-08-06 | |||
JP2004230426A | 2004-08-19 | |||
JPH05185284A | 1993-07-27 | |||
JP2007136491A | 2007-06-07 | |||
JP2005334895A | 2005-12-08 | |||
JP2018024023A | 2018-02-15 |
Other References:
See also references of EP 3834982A4
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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