Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2020/153418
Kind Code:
A1
Abstract:
A flux according to the present invention is used for soldering, and contains: a thixotropic agent which contains a polyamide compound that has UV absorption over the wavelength range of 240-500 nm in the ultraviolet absorption spectrum; and a solvent which contains a glycol ether solvent.
Inventors:
YUKIKATA KAZUHIRO (JP)
UCHIDA NORIYOSHI (JP)
UCHIDA NORIYOSHI (JP)
Application Number:
PCT/JP2020/002252
Publication Date:
July 30, 2020
Filing Date:
January 23, 2020
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
C22C13/00; B23K35/26; B23K35/363
Foreign References:
| JP2004202518A | 2004-07-22 | |||
| JP2007245157A | 2007-09-27 | |||
| JPH10249577A | 1998-09-22 |
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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