Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2024/062951
Kind Code:
A1
Abstract:
The flux according to the present invention is intended to be used for soldering, and comprises at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure, at least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain having 1 to 11 carbon atoms inclusive and an imidazole derivative having a phenyl group, and at least one liquid polymerizable compound selected from the group consisting of a liquid resin and a liquid polymerizable fatty acid.
Inventors:
YUKIKATA KAZUHIRO (JP)
KAMIO RYO (JP)
KAMIO RYO (JP)
Application Number:
PCT/JP2023/032877
Publication Date:
March 28, 2024
Filing Date:
September 08, 2023
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00; C22C13/02
Domestic Patent References:
| WO2019142826A1 | 2019-07-25 | |||
| WO2021261502A1 | 2021-12-30 | |||
| WO2021166967A1 | 2021-08-26 |
Foreign References:
| JP2012004347A | 2012-01-05 | |||
| JP2020189337A | 2020-11-26 |
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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