Title:
FLUX AND SOLDERING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/009097
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a flux and a soldering material that tend not to have reduced activity at high temperatures and that are capable of suppressing migration occurrence. This flux contains an isocyanuric acid derivative having 2 or more carboxyl groups.
Inventors:
UCHIDA NORIYOSHI (JP)
Application Number:
PCT/JP2018/023757
Publication Date:
January 10, 2019
Filing Date:
June 22, 2018
Export Citation:
Assignee:
KOKI KK (JP)
International Classes:
B23K35/363
Domestic Patent References:
| WO2017033930A1 | 2017-03-02 |
Foreign References:
| JP2002146159A | 2002-05-22 | |||
| JP2004018452A | 2004-01-22 | |||
| JP2007070481A | 2007-03-22 | |||
| JP2012241178A | 2012-12-10 | |||
| JPH05318176A | 1993-12-03 | |||
| JP2016093816A | 2016-05-26 |
Other References:
See also references of EP 3650164A4
Attorney, Agent or Firm:
IZAWA Makiko (JP)
Download PDF:
Previous Patent: WATER STOP STRUCTURE FOR ELECTRIC WIRE BUNDLE
Next Patent: IMAGING APPARATUS, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS
Next Patent: IMAGING APPARATUS, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS