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Patent Searching and Data


Title:
FLUX TOOL USING ELASTIC PAD
Document Type and Number:
WIPO Patent Application WO/2021/194093
Kind Code:
A1
Abstract:
The present invention relates to a flux tool using an elastic pad and, more specifically, to a flux tool configured for flux printing equipment for dotting a flux in order to attach a solder ball to a substrate. Particularly, according to the present invention, respective flux pins configured for a flux tool are pressurized individually (pin-by-pin) during a flux dotting process such that, even if the substrate or die is deformed, a flux can be dotted with a constant quality. Specifically, according to the present invention, all flux pins are uniformly pressurized primarily by an elastic force from an elastic pad, and respective flux pins are individually (pin-by-pin) pressurized on the lower surface. Accordingly, the height of each flux pin can be adjusted according to the flatness and bending shape of the substrate or die during flux dotting, thereby minimizing defective flux dotting. A conductive thin film may be provided on the lower surface of the elastic pad so as to prevent static electricity and to prevent damage and deformation of the elastic pad. Therefore, reliability and competitiveness can be improved in semiconductor fields, semiconductor package manufacturing fields, PCB manufacturing fields, particularly wafer level chip scale package (WLCSP)-based manufacturing fields, solder ball placement system fields, fields related to flux tools and flux printing equipment comprising same, and other fields similar or related thereto.

Inventors:
LEE KYOUHO (KR)
Application Number:
PCT/KR2021/001936
Publication Date:
September 30, 2021
Filing Date:
February 16, 2021
Export Citation:
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Assignee:
SSP INC (KR)
International Classes:
H05K3/34; B23K3/06; B23K3/08
Foreign References:
KR20050107196A2005-11-11
JP2011108948A2011-06-02
KR20180119269A2018-11-02
KR20190074699A2019-06-28
KR102206228B12021-01-22
Attorney, Agent or Firm:
JUNG, Doo Seung (KR)
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