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Title:
FLUX
Document Type and Number:
WIPO Patent Application WO/2017/122750
Kind Code:
A1
Abstract:
Provided is a flux that allows soldering to be performed without requiring a procedure for removing a Cu-OSP film even with a Cu-OSP-treated substrate. The flux contains rosin, an organic acid, a benzoimidazole-based compound, and a solvent, wherein 30-70 % by mass of rosin, 1-10 % by mass of the organic acid, 0.2-10 % by mass of the benzoimidazole-based compound, and 20-60 % by mass of the solvent are contained, and this flux is characterized in that the benzoimidazole-based compound is formed of at least one of a 2-alkyl benzoimidazole and a 2-alkyl benzoimidazole hydrohalide.

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Inventors:
NISHIZAKI TAKAHIRO (JP)
HAGIWARA TAKASHI (JP)
KAWASAKI HIROYOSHI (JP)
Application Number:
PCT/JP2017/000890
Publication Date:
July 20, 2017
Filing Date:
January 12, 2017
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363
Foreign References:
JP2014117737A2014-06-30
JPH05237688A1993-09-17
JPH03124395A1991-05-27
JP2007083253A2007-04-05
JPH0621625A1994-01-28
JP2015160244A2015-09-07
JPH05237688A1993-09-17
JP2014101553A2014-06-05
JP2006054467A2006-02-23
Other References:
See also references of EP 3409412A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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