Title:
FLUXING UNDERFILL COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO2002070191
Kind Code:
A8
Abstract:
This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages ("CSPs"), ball grid arrays ("BGAs"), land grid arrays ("LGAs"), flip chip assemblies ("FCs") and the like, each of which having a semiconductor chip, such as large scale integration ("LSI"), or semiconductor chips themselves and a circuit board to which the devices or chips, repsectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.
Inventors:
KONARSKI MARK K (US)
KRUG JOHN P (US)
KRUG JOHN P (US)
Application Number:
PCT/US2001/047898
Publication Date:
December 27, 2002
Filing Date:
December 13, 2001
Export Citation:
Assignee:
HENKEL LOCTITE CORP (US)
KONARSKI MARK K (US)
KRUG JOHN P (US)
KONARSKI MARK K (US)
KRUG JOHN P (US)
International Classes:
B23K35/36; C08G59/58; C08K5/09; B23K35/363; C08L63/00; H01L21/56; H01L23/29; (IPC1-7): B23K35/36; H01L21/56; H01L23/29
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