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Title:
FOAM MOLDING MASTERBATCH, AND MOLDED FOAM ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/073824
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a foam molding masterbatch that can be advantageously used in molding involving the application of strong shear forces or molding requiring low molding temperatures, has a high expansion ratio, and is capable of producing a molded foam article having a good-quality appearance; and a molded foam article using said foam molding masterbatch. The present invention is a foam molding masterbatch containing a base resin and thermally expandable microcapsules, the masterbatch having an absolute specific gravity of at least 0.80 g/cm3 and a Mooney viscosity ML 1+4 (100°C) of 20–90, the base resin containing an EPDM resin, and the masterbatch containing 40–300 parts by weight of the thermally expandable microcapsules per 100 parts by weight of the base resin.

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Inventors:
UCHIYAMA, Yusaku (4560, Kaiseicho, Shunan-sh, Yamaguchi 06, 〒7460006, JP)
Application Number:
JP2018/036332
Publication Date:
April 18, 2019
Filing Date:
September 28, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 47, 〒5300047, JP)
International Classes:
C08J9/32; C08J3/22; C08K5/01; C08K5/02; C08K9/10; C08L23/16; C08L27/08; C08L33/20
Domestic Patent References:
WO2017014064A12017-01-26
WO2010038615A12010-04-08
Foreign References:
JP2012213615A2012-11-08
JP2004091746A2004-03-25
JPH059326A1993-01-19
JPH05279524A1993-10-26
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (5-36, Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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