Title:
FOAMABLE RESIN MULTILAYER MOLDED BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/101198
Kind Code:
A1
Abstract:
This foamable resin multilayer molded board of the present invention is characterized by having: a planar fusion layer in which at least a foamable resin material for molding a planar fusion layer is fused in a planar shape; and a porous layer in which a foamable resin material for forming a porous layer is fused in a spot shape to be porous, wherein these layers are integrally formed. Therefore, the foamable resin multilayer molded board is provided, which has high air permeability and water permeability as well as excellent heat insulation properties, and which also has high durability.
Inventors:
SAWAGUCHI TETSUYA (JP)
Application Number:
PCT/JP2017/042376
Publication Date:
June 07, 2018
Filing Date:
November 27, 2017
Export Citation:
Assignee:
TOHOKU SHIZAI KOUGYO CO LTD (JP)
International Classes:
B32B5/32; B29C44/00
Domestic Patent References:
| WO2012058177A1 | 2012-05-03 |
Foreign References:
| JPS5747629A | 1982-03-18 | |||
| JP2016188325A | 2016-11-04 | |||
| JP2011012395A | 2011-01-20 | |||
| JPH08110153A | 1996-04-30 | |||
| JP2012166386A | 2012-09-06 | |||
| JPH11953A | 1999-01-06 | |||
| JP2013248847A | 2013-12-12 | |||
| JPS55139230A | 1980-10-30 | |||
| JP2011074151A | 2011-04-14 | |||
| JP2004098352A | 2004-04-02 |
Attorney, Agent or Firm:
NISHIZAWA Toshio (JP)
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