Title:
FOAMABLE RESIN SHEET AND THERMOCONDUCTIVE FOAM SHEET FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/170786
Kind Code:
A1
Abstract:
A foamable resin sheet containing 100-400 parts by mass of a thermal conductor, 1-30 parts by mass of a foaming agent, and 0.10-0.50 part by mass of a foaming auxiliary with respect to 100 parts by weight of an elastomer resin containing 50-70 mass% of an elastomer (I) having a Mooney viscosity of 15-100 ML (1+4) at 100°C and 30-50 mass% of an elastomer (II) having a viscosity of 3-1,000 Pa∙s at 23°C.
Inventors:
HAMADA MASAHIRO (JP)
TAKASU KENICHIRO (JP)
TAKASU KENICHIRO (JP)
Application Number:
PCT/JP2017/013092
Publication Date:
October 05, 2017
Filing Date:
March 29, 2017
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08J9/10; C08K3/00; C08K5/098; C08K5/23; C08L21/00; C09K5/14
Domestic Patent References:
| WO2014083890A1 | 2014-06-05 |
Foreign References:
| JP2014209537A | 2014-11-06 | |||
| JP2009120728A | 2009-06-04 | |||
| JP2000044711A | 2000-02-15 | |||
| JP2011184571A | 2011-09-22 | |||
| JP2003292702A | 2003-10-15 |
Attorney, Agent or Firm:
TAGUCHI, MASAHIRO et al. (JP)
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