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Patent Searching and Data


Title:
FOLDABLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/142185
Kind Code:
A8
Abstract:
A foldable substrate is provided that includes a first substrate portion with a first upper surface and a second substrate portion with a second upper surface. A foldable bridge portion couples the first substrate portion to the second substrate portion. The foldable bridge portion includes a coupling strip that extends from the first substrate portion to the second substrate portion with a gap corresponding to a portion of the coupling strip where the gap is defined between the first and second substrate portions by removing portions of a starting wafer substrate. The first and second portions, in one embodiment, include magnetic field sensors and the foldable bridge portion can be bent to arrange the two portions at a predetermined angle to one another. Once bent, the sensor package can be incorporated into a magnetic field sensor assembly to be integrated with other control circuitry.

Inventors:
ZHAO YANG (US)
LIU HAIDONG (CN)
CAI YONGYAO (US)
LI ZONGYA (CN)
HAWAT NOUREDDINE (US)
MA JUN (CN)
ZHANG FENG (CN)
DUAN ZHIWEI (CN)
JIANG LEYUE (CN)
Application Number:
PCT/US2013/030792
Publication Date:
November 28, 2013
Filing Date:
March 13, 2013
Export Citation:
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Assignee:
MEMSIC INC (US)
International Classes:
G01L9/12; G01B7/16; G11B5/127
Attorney, Agent or Firm:
SCHURGIN, Stanley, M. et al. (Ten Post Office SquareBoston, MA, US)
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