Title:
FOLDABLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/142185
Kind Code:
A8
Abstract:
A foldable substrate is provided that includes a first substrate portion with a first upper surface and a second substrate portion with a second upper surface. A foldable bridge portion couples the first substrate portion to the second substrate portion. The foldable bridge portion includes a coupling strip that extends from the first substrate portion to the second substrate portion with a gap corresponding to a portion of the coupling strip where the gap is defined between the first and second substrate portions by removing portions of a starting wafer substrate. The first and second portions, in one embodiment, include magnetic field sensors and the foldable bridge portion can be bent to arrange the two portions at a predetermined angle to one another. Once bent, the sensor package can be incorporated into a magnetic field sensor assembly to be integrated with other control circuitry.
Inventors:
ZHAO YANG (US)
LIU HAIDONG (CN)
CAI YONGYAO (US)
LI ZONGYA (CN)
HAWAT NOUREDDINE (US)
MA JUN (CN)
ZHANG FENG (CN)
DUAN ZHIWEI (CN)
JIANG LEYUE (CN)
LIU HAIDONG (CN)
CAI YONGYAO (US)
LI ZONGYA (CN)
HAWAT NOUREDDINE (US)
MA JUN (CN)
ZHANG FENG (CN)
DUAN ZHIWEI (CN)
JIANG LEYUE (CN)
Application Number:
PCT/US2013/030792
Publication Date:
November 28, 2013
Filing Date:
March 13, 2013
Export Citation:
Assignee:
MEMSIC INC (US)
International Classes:
G01L9/12; G01B7/16; G11B5/127
Attorney, Agent or Firm:
SCHURGIN, Stanley, M. et al. (Ten Post Office SquareBoston, MA, US)
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