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Patent Searching and Data


Title:
FOLDED PIE DOUGH
Document Type and Number:
WIPO Patent Application WO/2002/017727
Kind Code:
A1
Abstract:
A folded pie dough consisting of dough layers and fat layers characterized in that solid fat is dispersed in the dough layers; and a process for producing a pie, which can be smoothly baked and has a favorable texture, by baking or frying the above-described dough within a short period of time.

Inventors:
OKANO HIDEO (JP)
IIZUKA MASAATU (JP)
HASEGAWA YASUNOBU (JP)
ARIMURA TOSHIAKI (JP)
Application Number:
PCT/JP2001/007084
Publication Date:
March 07, 2002
Filing Date:
August 17, 2001
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
OKANO HIDEO (JP)
IIZUKA MASAATU (JP)
HASEGAWA YASUNOBU (JP)
ARIMURA TOSHIAKI (JP)
International Classes:
A21D10/00; A21D13/00; A21D13/08; (IPC1-7): A21D10/00; A21D13/00
Foreign References:
US3388997A1968-06-18
JPS4421388B11969-09-12
JPH119178A1999-01-19
JPH11318319A1999-11-24
Attorney, Agent or Firm:
Takahashi, Fumiko c/o AJINOMOTO CO. (INC. Intellectual Property Department 1-1 Suzuki-ch, Kawasaki-ku Kawasaki-shi Kanagawa, JP)
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