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Title:
FOODSTUFF PACKAGE AND METHOD FOR STORING FOODSTUFFS INTO PACKAGING CONTAINER, THE FOODSTUFFS BEING INDIVIDUALLY PACKAGED IN PAPER WRAPPERS
Document Type and Number:
WIPO Patent Application WO/2012/002256
Kind Code:
A1
Abstract:
Provided are: a foodstuff package which is configured in such a manner that, when foodstuffs individually packaged in paper wrappers are affixed to a packaging container using a hot-melt adhesive, a heat shock caused by the heated hot-melt adhesive is prevented from being applied to the foodstuffs; and a method for storing foodstuffs into a packaging container, the foodstuffs being individually packaged in paper wrappers. A foodstuff packaging body (1) is configured in such a manner that foodstuffs (2) individually packaged in paper wrappers (3) each have a fin (19) as the margin for adhesion, the fin (19) being the portion of the paper wrapper (3) which extends out of one end of the foodstuff (2) in the longitudinal direction thereof. The individually packaged foodstuffs (2) are arranged along an inner surface wall (51) of the packaging container (4), and the adhesion margin fins (19) are arranged in order next to each other. A part of the inner surface wall (51) is folded back as a pressing plate (25). The arranged adhesion margin fins (19) are affixed within the packaging container (4) by a holt-melt adhesive (44) while being sandwiched between the inner surface wall (51) and the pressing plate (25).

Inventors:
SATO, Hiroshi (20-1, Nishi-shinjuku 3-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
佐藤 洋 (〒23 東京都新宿区西新宿3丁目20番1号 株式会社ロッテ内 Tokyo, 〒1600023, JP)
Application Number:
JP2011/064465
Publication Date:
January 05, 2012
Filing Date:
June 23, 2011
Export Citation:
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Assignee:
LOTTE CO., LTD. (20-1, Nishi-shinjuku 3-chome Shinjuku-k, Tokyo 23, 〒1600023, JP)
株式会社ロッテ (〒23 東京都新宿区西新宿3丁目20番1号 Tokyo, 〒1600023, JP)
SATO, Hiroshi (20-1, Nishi-shinjuku 3-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
International Classes:
B65D75/38; B65D5/50; B65D85/60; B65D85/72
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (Sun Mullion NBF Tower 21st Floor, 6-12, Minamihommachi 2-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)
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Claims: